Chip Technology
Creating the Future
Chip Technology Creating the Future
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Non-isolated drive IC
High-voltage negative pressure drive technology (-40V/600ns), covering a wide voltage range, with strong driving capability, suitable for high-precision control scenarios such as industrial automation and optical communication.
IPM
Long-term bulk application verification with leading industry clients, full-package matrix covering mainstream demands, seamless compatibility with mature design solutions; independently developed chips and packaging processes, low EMI/high interference resistance, supporting efficient and stable operation of variable frequency home appliances, industrial servo systems, and industrial robots.
Isolation Drive IC
High common-mode transient immunity (100kV/μs) and integrated protection features (Miller clamp, soft shutdown), compatible with SiC/IGBT drivers, ensuring safe and stable high-frequency system operation.
Power Module
Using low-inductance packaging and advanced cooling technology, the power density is industry-leading, suitable for high-power scenarios such as photovoltaic inverters and main drives for new energy vehicles.
PMIC
High-efficiency multi-channel power management, supporting ultra-low quiescent current (as low as 35nA) and cold start, significantly extending battery life, optimized for IoT and automotive devices
Automotive-grade products
The entire series has passed AEC-Q certification, integrating short-circuit/over-temperature protection, covering OBC, DC-DC, and ADAS systems, supporting efficient intelligence in new energy vehicles.
SiC
Including fully plastic-encapsulated IPMs integrating SiC MOSFETs, driver and protection chips, as well as standard packaged modules with topologies mainly composed of SiC MOSFETs, these high-performance products outperform silicon-based power semiconductors and are suitable for efficient, high-frequency power electronics applications.
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News
2024-10-10